webleads-tracker

Home  >  ADVANCED PACKAGING  > Could copper pillar change the ecosystem?...
  >  ADVANCED PACKAGING
Dec 11th, 2013
 
Could copper pillar change the ecosystem?
 
The future of bumping is copper, and that could change everything. Though originally developed at the IDMs, players from foundries to OSATs are now developing a variety of differing copper pillar and micro-bumping solutions for a range of customers, looking re-designing the substrate, weighing extending refl ow vs scaling thermal compression bonding, and developing probe and test systems.
Send to a friend

Though copper bumping has been around for years, higher density devices mean growing demand for higher density interconnect than the ~130-140 μm pitch that can be done with solder bumps. As mobile application or baseband processors increasingly require the high density of copper pillars for small size at 28nm and below, and memory soon starts to go to wide I/O and DDR4 stacked with processors needing higher pin counts and reduced parasitics, manufacturers are focusing on scaling copper technology to tighter pitches, higher volumes, and of course lower costs.

To read the complete article, please click here

To register to 3D Packaging magazines, please click here

 

 
More ADVANCED PACKAGING news

Aug 29th
Aug 25th
Aug 12th
Aug 12th
Aug 11th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr