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Jan 10th, 2014
New DELO adhesives for MEMS packaging
DELO Industrial Adhesives presents new adhesives MEMS packaging with unique combinations of properties.
For the first time, MEMS adhesives combine high flexibility and the utmost shear strength, while providing the best processing properties.
Microelectromechanical systems, also called MEMS, are on the rise and are meanwhile found in many everyday products, such as mobile phones and automotive applications. “Although these microsystems are just a few millimeters in size, there is still a trend towards miniaturization”, says Robert Saller, VP Sales International at DELO. “Where previously used adhesives, such as silicones, reach their limits, our new products feature the best performance. It’s not only that they are very flexible. They also have a high die shear strength and are easy to process. Thus, they support the development of even smaller MEMS.”
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