To download the latest issue
Nov 4th, 2011
DRAM server roadmap points to DDR4 and 3D
Once upon a time, the DRAM server roadmap was predictable, as memory vendors simply marched down the natural progression of DDR interface standards.
Now, the DRAM server roadmap is muddled with both DDR and 3D chip schemes to address a major problem: The industry is scrambling for a new, low-power DRAM solution to help tackle the soaring bandwidth requirements — and power consumption rates — for servers in the datacenter. DRAMs provide fast data access times, but they are falling behind the I/O curve and require heat-generating refresh cycles.
To read the complete article, please click here.
More ADVANCED PACKAGING news