webleads-tracker

Home  >  ADVANCED PACKAGING  > Dow, Nantong Fujitsu, SMIC, SPIL and more featured on the ...
  >  ADVANCED PACKAGING
Jul 23rd, 2014
 
Dow, Nantong Fujitsu, SMIC, SPIL and more featured on the NCAP & Yole Symposium program
 
Advanced Packaging & System Integration Technology Symposium on August 28, 2014 in Wuxi, China. Organized by Yole Développement and NCAP.
Send to a friend

Yole Développement and NCAP organize an Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology in Wuxi on August 28th, 2014. The seminar includes presentations on interposer & 3D integration, sensors & MEMS technologies and Manufacturing Challenges. The Panel discussion will end the day. 

Yole Développement and NCAP, together with the below confirmed speakers, will share their expertise over 3 sessions:
- Interposer and 3D Integration Technologies: Huatian Technology, SPIL, SUSS MicroTec...
- Sensors and MEMS Packages: SMIC...
- NEW: Manufacturing Challenges: Dow, Nantong Fujitsu...

Also, feel free to register by (August 4) August 14 to benefit from early bird rate!

For more information, please contact Camille (veyrier@yole.fr).

 

 
More ADVANCED PACKAGING news

Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr