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Jul 23rd, 2014
Dow, Nantong Fujitsu, SMIC, SPIL and more featured on the NCAP & Yole Symposium program
Advanced Packaging & System Integration Technology Symposium on August 28, 2014 in Wuxi, China. Organized by Yole Développement and NCAP.
Yole Développement and NCAP organize an Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology in Wuxi on August 28th, 2014. The seminar includes presentations on interposer & 3D integration, sensors & MEMS technologies and Manufacturing Challenges. The Panel discussion will end the day.
Yole Développement and NCAP, together with the below confirmed speakers, will share their expertise over 3 sessions:
Discover the detailed preliminary program here.
Also, feel free to register by (
For more information, please contact Camille (firstname.lastname@example.org).
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