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Jul 23rd, 2014
 
Dow, Nantong Fujitsu, SMIC, SPIL and more featured on the NCAP & Yole Symposium program
 
Advanced Packaging & System Integration Technology Symposium on August 28, 2014 in Wuxi, China. Organized by Yole Développement and NCAP.
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Yole Développement and NCAP organize an Advanced Packaging Seminar focused on Advanced Packaging & System Integration Technology in Wuxi on August 28th, 2014. The seminar includes presentations on interposer & 3D integration, sensors & MEMS technologies and Manufacturing Challenges. The Panel discussion will end the day. 

Yole Développement and NCAP, together with the below confirmed speakers, will share their expertise over 3 sessions:
- Interposer and 3D Integration Technologies: Huatian Technology, SPIL, SUSS MicroTec...
- Sensors and MEMS Packages: SMIC...
- NEW: Manufacturing Challenges: Dow, Nantong Fujitsu...

Discover the detailed preliminary program here.

Also, feel free to register by (August 4) August 14 to benefit from early bird rate!

For more information, please contact Camille (veyrier@yole.fr).

 

 
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