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Apr 19th, 2013
 
Dry film negative photoresist is designed for MEMS
 
Optimized for hot roll lamination and processing on Micro-Electro-Mechanical Systems (MEMS) and IC wafers, DF-1014 comes in various thickness formats from 5–50 µm, ±5% and features glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C.
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Exhibiting resistance to extreme moisture conditions and corrosive chemicals, cured chemistry can withstand harsh environments. Material formulation is compatible and can be used in contact with EMS spin coatable photoresists.

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