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Jun 6th, 2012
ECTC: Focus on 3D integration and TSVs
A main focus of this year’s Electronic Components and Technology Conference (ECTC), held this week in San Diego, is 3D integration and through silicon vias (TSVs). “The biggest trend for the last couple of years has been 3D and TSV and it continues to be that way,” said David McCann of GLOBALFOUNDRIES and ECTC conference chair.
This year, the conference features a set of sessions specifically on 3D TSVs, with minimal overlap. There’s also an additional session specifically on interposers, otherwise known as 2.5D. “The industry really wants to see 2.5D happen as an easier way to do 3D before all the 3D tools are in place,” McCann said. “The struggle is over how much is an interposer going to cost.”
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