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May 6th, 2013
EI’s SiP successful in hit-to-kill interceptor test
Endicott Interconnect Technologies, Inc. (EI) announced that its System-In-Package (SiP) technology performed successfully as a key subsystem of Lockheed Martin's Extended Area Protection and Survivability (EAPS) Program during a test on March 22 at White Sands Missile Range, N.M.
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EI's technology acts as the command center of a very small hit-to-kill interceptor designed to defeat rocket, artillery and mortar attacks. 

El’s SiP products integrate multiple lC, assembly and test technologies into modular lC packages. One such product optimized for aerospace applications is the CoreEZ. El's CoreEZ semiconductor package uses the HyperBGA manufacturing platform to offer a thin core build-up flip chip package with very dense core vias using a cost sensitive material set. The core via density provides 199 micron via-to-via core pitch resulting in an essentially coreless structure, which can accommodate ASIC FPGA and many other semiconductor solutions. El also offers HyperBGA packages that are composed of materials that have passed NASA outgassing testing and are recommended for aerospace applications up to radiation tolerant.

The company offers turkey SiP technical solutions that include substrate and module design, substrate fabrication (50 µm laser-drilled vias, 25/25 µm line width and space, embedded passives, and Cu/in/Cu cores), and lC assembly (flip chip pitch down to 150 µm, wirebonding, and SMD on both sides).

To read more: http://www.electroiq.com


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