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Jul 10th, 2013
 
EV Group celebrates strong growth and new manufacturing process solutions at SEMICON West 2013
 
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has achieved strong revenue growth and expanded its headcount for the first half of 2013.
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The company attributes this success to continuing demand for its flexible process solutions designed to address high-volume manufacturing (HVM) needs across multiple markets--including 3D-ICs, MEMS, power devices and compound semiconductors.  EVG's latest technology innovations that address these and other markets will be showcased this week at SEMICON West 2013 at the Moscone Convention Center in San Francisco.  In addition to unveiling a series of new solutions, EVG also reports that it continues to expand its wafer processing services and process development consultation capabilities worldwide as part of the company's long-term growth strategy.

"2013 has been a strong year for EV Group as we continue to invest in new technologies and capabilities to support our customers' ability to ramp next-generation devices to volume production quickly and cost-effectively at high yields," said Dave Kirsch, vice president and general manager of EV Group North America.  "This requires not only leading-edge process equipment but also world-class global support and process development services. EVG's local teams work hand in hand with our corporate headquarters to provide increased flexibility and capability for our customers.  That includes our ability to offer small-scale and pilot-production services at our global applications labs, which is a key differentiator for us and a key value proposition for customers."

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