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May 16th, 2014
 
EV Group ships wafer bonding and bond alignment system to University of Pennsylvania for advanced nanotechnology research
 
EVG®510 and EVG®620BA installed at U. of Penn's Quattrone Nanofabrication Facility.
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EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has shipped an EVG®510 semi-automated wafer bonding system and an EVG®620 automated bond alignment system to the University of Pennsylvania (Penn).  The systems are installed in the Quattrone Nanofabrication Facility in the Singh Center for Nanotechnology at Penn in Philadelphia, where they are being used for anodic and thermocompression bonding processes in the fabrication of advanced micro- and nano-systems.

According to Dr. Viorel Dragoi, chief scientist at EV Group, "Academic institutions like the University of Pennsylvania provide critical contributions to advanced research and development across a multitude of high-technology industries.  We are pleased that Penn's Quattrone Nanofabrication Facility is using our wafer bonder and bonding alignment systems to help their students, faculty and corporate partners to move their cutting-edge research forward into new and exciting nanotechnology applications."

The Quattrone Nanofabrication Facility is a multi-user facility serving the nanofabrication needs of the Penn community as well as those of external users.  It houses a suite of tools for micro- and nano-fabrication, including optical and electron-beam lithography, vapor deposition, etching, packaging and electrical testing.  Adding bonding capabilities with EV Group's EVG510 and EVG620 systems enables the facility to implement new processes that can support a variety of applications such as microfluidics, MEMS, and heterogeneous integration.

The EVG510 wafer bonding system provides fully automated processing with manual loading and unloading.  It features EV Group's field-proven uniform heating and pressure application systems.  With a modular bond chamber design that accommodates wafer sizes up to 200 mm, the EVG510 provides the lowest cost-of-ownership for both R&D and pilot-line production.  The EVG620 bond alignment system supports bond alignment of double- or triple-wafer stacks up to 150-mm wafer sizes, and offers the highest precision, flexibility, ease of use and modular upgrade capability.


 
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