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Jul 2nd, 2014
EV group clears key barriers to 3D-IC/TSV high-volume manufacturing with breakthrough fusion wafer bonding solution
GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, unveiled the GEMINI®FB XT-its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs). Featuring up to a three-fold improvement in wafer-to-wafer bond alignment accuracy as well as a 50 percent increase in throughput over the previous industry benchmark platform, the GEMINI FB XT clears several key hurdles to the industry's adoption of 3D-IC/TSV technology in order to drive continuous improvements in device density and performance without the need for increasingly costly and complex lithography processing.
FB XT is optimized for ultra-high throughput and productivity. Additional pre- and post-processing modules have been added for wafer cleaning and surface preparation, plasma activation and wafer bond alignment that enable increases in throughput by up to 50 percent. This significantly increased throughput combined with the tighter alignment specifications supports IC manufacturers' efforts to move wafer stacking upstream in the manufacturing value chain from mid-end-of-line (MEOL) and back-end-of-line (BEOL) processing to front-end-of-line (FEOL) processing. This, in turn, enables device manufacturers to integrate more functionality into their product at the wafer level, where higher levels of parallel processing can significantly drive down 3D-IC/TSV manufacturing costs.
"While EUV lithography continues to face delays, 3D-IC/TSV integration has emerged as one of the most promising approaches to extending Moore's Law for future device generations. Yet enabling 3D-IC/TSV integration for emerging memory and logic applications is impossible without the ability to achieve tight wafer-to-wafer alignment," stated Paul Lindner, executive technology director at EV Group. "EVG is continuing to drive improvements across our suite of solutions for 3D-IC/TSV applications to help bring our customers closer to the goal of commercializing 3D-IC technology. Our new GEMINI FB XT platform marks a major milestone along that path, and we look forward to working with our customers to make the promise of 3D-IC high-volume manufacturing a reality for them."
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