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Mar 14th, 2013
EVG ships 300-mm wafer bonding system to leading chinese foundry for 3D IC and advanced packaging applications
EVG a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has installed a fully automated 300-mm system from EVG's Gemini® product family of integrated wafer bonding clusters to a leading Chinese semiconductor foundry. This customer will use the system for 3D IC integration and advanced packaging—two high-volume applications for which EVG's wafer bonding solutions have become the de facto industry standard.
"This order from one of the largest Chinese foundries further cements EV Group's position as the market and technology leader in wafer bonding for leading-edge applications," stated Hermann Waltl, executive sales and customer support director at EV Group. "China is an important market for us, and this order is further testament to our continued success in penetrating leading high-volume microelectronics manufacturers in China—from advanced substrate suppliers to light emitting diode (LED) and semiconductor device makers."
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