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Apr 8th, 2014
Extended product range and technical presentations at the SMT Hybrid packaging 2014
At the SMT Hybrid Packaging 2014, Heraeus presents products from the range Bonding Wires and Circuits & Components.
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Focusing on bonding wires and thick film pastes
Heraeus experts inform via tutorial and lecture

The International Trade Fair for System Integration in Micro Electronics will take place from 06th to 08th May in Nuremberg, Germany.

Tutorial and Presentation
Heraeus experts will be talking about industry-relevant technical topics at the SMT. Jörg Trodler, Development Engineer Assembly Materials, will be conducting a tutorial on the subject “Solder Joint Quality in the Lead-free Assembly and Interconnection Technology” (06th May 2014 from 2 to 5 p.m). Jürgen Dick, Product Management Wedge Bonding Wires, will be giving the lecture “Aluminum, Copper, Hybrid – Advanced Bonding Wires for Power Electronics" (07.05.2014 at 11:00 a.m., Exhibition Forum, hall 9).

Products from the range Bonding Wires
At the fair SMT Hybrid, Heraeus will be presenting bonding wires and ribbons based on precious metals as well as more cost-effective materials. The company will be focusing on products made of aluminum, copper and bondable aluminum-copper hybrid materials. These bonding wires increase the durability and reliability in robust electronic power modules. In addition, the manufacturer shows its new range of alloyed silver wires and coated bonding wires.

Enlarged product portfolio – from Thick Film to Circuits & Components
At the beginning of the year, the former Business Unit Thick Film merged with part of the Conductive Polymers Division to form the new Business Unit: Circuits & Components. In the course of a restructuring process, the BU now offers a comprehensive product portfolio of silver pastes and high-end conductive polymers, mainly employed in the manufacture of capacitors. This consolidated portfolio will be presented at the upcoming SMT show for the first time. The reorganization bundles products and competencies enabling Heraeus to enlarge its range and provide  customized solutions from just one source.

Within the new BU  Heraeus offers conductive polymers (brand CleviosTM) for solid electrolyte capacitors (tantalum and aluminum). Newly developed thick copper system, the material system Celcion™ for LED applications, low temperature pastes for OLED applications and Pb-free resistor pastes are further highlights at the Heraeus booth.


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