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Sep 6th, 2012
Focus on 2012 Taiwanese OSATs investments
Most Taiwan-based IC packaging and testing firms including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL) and Powertech Technology (PTI) all plan to ramp up their capex in 2012, according to industry sources.
ASE expects its capex for 2012 to reach US$800 million compared to US$780 million of a year earlier. Of the total investment, US$250 million will be used for flip chip packaging and bumping facilities, one-third of the capital will be for ramping up copper wire-bonding lines, and the rest will be used for the purchase of low-pin-count packaging equipment.
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