webleads-tracker

Home  >  ADVANCED PACKAGING  > Focus on 3DIC and advanced packaging technology ecosystem ...
  >  ADVANCED PACKAGING
Jun 15th, 2012
 
Focus on 3DIC and advanced packaging technology ecosystem and supply chain mutations
 
With many advanced packaging processes taking place on the semiconductor wafer, the traditional supply chain of front-end fab at the foundry and back-end fab at the packaging and test house is falling apart. Solid State Technology’s ConFab session, “Advanced Packaging and Progress in 3D Integration,” focused heavily on the new supply chain, or perhaps ecosystem is a better term, supporting advanced semiconductor packaging.
Send to a friend

The supply chain faces a new reality, and new questions, said David McCann, senior director of technical business operations at GLOBALFOUNDRIES. How do packaging houses and IC designers determine the optimum locations for through silicon vias (TSVs) for power delivery and noise immunity when they are connecting stacks of die from different suppliers?

Full text here.


 
More ADVANCED PACKAGING news

Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr