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Nov 9th, 2012
Fujitsu Semiconductor will start production of GaN power devices in 2013
Fujitsu Semiconductor achieves high output power of 2.5kW in power supply units for servers.
Fujitsu Semiconductor Limited announced that it successfully achieved high output power of 2.5kW in server power supply units equipped with gallium-nitride (GaN) power devices built on a silicon substrate. Fujitsu Semiconductor aims to start volume production of the GaN power devices in the second half of 2013. These devices will enable Fujitsu Semiconductor to propose their use in a wide variety of value-enhancing power supply applications, significantly contributing to the realization of a low-carbon society. Fujitsu Semiconductor is aiming to achieve approximately 10 billion yen in sales of GaN power devices in fiscal 2015.
Recently, in a collaborative effort together with Fujitsu Laboratories Limited, Fujitsu Semiconductor has been engaging in technical development initiatives, such as developing a process technology for growing high quality GaN crystals on a silicon substrate, developing device technologies, such as optimizing the design of electrodes to control the rise of on-resistance during switching, and devising a circuit layout for power supply units that can support the high-speed switching of GaN-based devices. These results have enabled Fujitsu Semiconductor, in a test circuit using a GaN power device, to succeed in achieving conversion efficiency that exceeds the performance of conventional silicon devices. Fujitsu Semiconductor also prototyped a power supply unit for servers equipped with a GaN power device for the power factor correction circuit and successfully achieved output power of 2.5kW.
Fujitsu Semiconductor views its success in these results as opening a path to high-voltage, large-current applications for its GaN power devices.
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