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Nov 9th, 2012
Fujitsu to start production of GaN power devices for high-efficiency power supply units in 2013
GaN technology achieves high output power of 2.5kW in power supply units for servers; demonstration set for Embedded Technology 2012 Nov. 14-16 in Yokohama, Japan.
Fujitsu Semiconductor announced that it has achieved high output power of 2.5kW in server power-supply units equipped with gallium-nitride (GaN) power devices built on a silicon substrate. The company will exhibit the device for the first time at Embedded Technology 2012 Conference and Exhibition (Nov. 14-16 at the Pacifico Yokohama Convention Center in Japan), and will start volume production of the GaN power devices by the second half of 2013. Fig 2: Fujitsu GaN Power Device Prototype -TO247 Package. Fujitsu Semiconductor plans to commercialize GaN power devices on a silicon substrate, increasing the diameters of the silicon wafers and enabling low-cost production. The company began work on GaN technology in 2009 and has provided specific power-supply-related partners with sample GaN power devices since 2011. Since then, Fujitsu has worked on optimizing them for use in power supply units. Fig 3: Efficiency comparison between Fujitsu’s GaN power device and conventional Si-based power device.
Fig 3: Efficiency comparison between Fujitsu’s GaN power device and conventional Si-based power device. Collaboration with Fujitsu Laboratories Yields Impressive Results Fujitsu Semiconductor has established a mass-production line for 6-inch wafers at its Aizu-Wakamatsu plant, and will begin full-scale production of GaN power devices in the second half of 2013. By offering GaN power devices optimized for customer applications and technology support for circuit designs, Fujitsu Semiconductor will support the development of low-loss, compact power supply units for a wide range of uses.
Fig 4: Output of power supply unit for servers with Fujitsu Semiconductor’s GaN power device. About Fujitsu Semiconductor America, Inc. Sources :
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