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Nov 16th, 2012
 
GT Advanced Technologies targets ultra-thin silicon wafers by acquiring Twin Creeks Technologies
 
GT Advanced Technologies Inc. announced it has acquired certain capital assets and intellectual property of Twin Creeks Technologies, Inc., a privately owned company that has developed an ion implanter technology that enables the production of lower cost thin substrates with minimal material (kerf) loss.
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  • Twin Creeks Technologies’ developed Hyperion™ Ion Implanter Technology  for production of ultra-thin wafers
  • Although the use of this approach for silicon solar cells is not expected at short term (see Yole’s report for more details), such wafers may find future application in power electronics.

The assets were purchased from Twin Creeks’ lenders in a private sale for approximately $10 million and royalties that will be based on future sales.

GT expects that Twin Creeks’ unique Hyperion™ ion implanter technology will have broad application in the production of engineered substrates for power semiconductors and thin wafers for solar applications. In addition, GT expects to pursue the development of thin sapphire laminates for use in applications such as cover and touch screen devices. The Hyperion ion implanter has the potential to minimize, or in some cases eliminate, the need for wafering saws, which would significantly lower the cost of production.

The assets acquired by GT relate primarily to the Hyperion ion implanter as well as Twin Creeks’ portfolio of approximately 30 granted US patents and over 70 pending US and international patent applications. GT’s ion implanter engineering team will be based in Danvers, MA.

GT expects to start the commercialization of this technology in late 2014.

 

 
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