Hamamatsu Photonics introduce a new RGB colour sensor Photo IC component which is now packaged in a WLCSP package. To access to the electrical contact through the backside of the wafer, 3D TSV interconnects have been realized.

The new device features I2C compatibility and uses a small and highly reliable WL-CSP (Wafer Level – Chip Size Package). To ensure low power consumption this sensor includes an auto-sleep function that automatically switches the detector to standby after a detection event. Another attractive feature of these devices is the ability to use lead-free reflow soldering, which improves the cost and speed of the manufacturing process.

The new devices compact size (1.18 x 1.68 x 0.58 mm) and simplicity of integration with products implementing the I2C protocol makes them ideal for LCD backlight and RGB-LED brightness adjustment in flat panel televisions and mobile phones.

Hamamatsu Photonics are a $1 billion photonics company supplying numerous opto-electronic components into the automotive market, mainly to Tier 1 vendors. The company production facilities are set-up to meet the specific quality requirements of the automotive industry, such as TS 16949.