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Mar 7th, 2012
Henkel underfill boasts high Tg for WLCSP and PoP devices
Henkel developed LOCTITE UF3810 underfill for high reliability and ease of rework when applied to next-generation wafer-level chipscale packages (WLCSP) and package-on-package (PoP) devices.
LOCTITE UF3810 is formulated to be halogen-free, reworkable, and demonstrate a glass transition temperature (Tg) of 100°C for robust thermal cycling reliability. The material flows fast and underfills at room temperature, curing quickly at 130°C. It is proven solder-compatible.
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