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Jul 3rd, 2014
High productivity and design flexibility are part of the main benefits of plasma dicing”, says Plasma-Therm...
Webcast sponsored by Plasma-Therm and powered by I-Micronews
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Mid-June, I-Micronews proudly presented a Plasma-Therm webcast, entitled “Can wafer dicing become a value-add operation?” This event was a great success, attracting more than 330+ registrants. Make sure you get the latest technology & market trends on wafer dicing process and watch the recorded version on http://www.i-micronews.com and in the “Archived Webcasts” section find the Plasma Dicing link.

“Wafer dicing can become a value-add operation, as impacting total cost of manufacturing and performance of semiconductor dies manufactured”, explained Pars Mukish, Activity Leader, LED & OLED, Yole Développement (Yole) during the webcast. According to Yole, the choice of the wafer dicing technology used depends mostly on material diced (substrate, epilayer, metal layer…), thickness of the wafers and requirements in terms of cost and performance.
Recently, following the development of laser scribing and dicing technologies, several new emerging technologies have been developed (stealth dicing, plasma dicing…), offering several benefits but also differing from traditional techniques.
Driven by IC packaging, performance requirements and development of new devices (LEDs, power electronics, MEMS…), the wafer dicing process is facing three main trends: thinner wafers, stronger die and non-silicon materials”, Pars Mukish adds. All these results are available in Yole’s report: LED Packaging (To be released mid-2014).

Plasma-Therm and ON Semiconductor (Cross licensing agreement signed beginning of 2014), both also highlighted the added-value of wafer dicing technologies with detailed presentations during the webcast. “High productivity and design flexibility are part of the main benefits of plasma dicing”, says Thierry Lazerand, Director of Technical Marketing, Plasma-Therm.
Gordon Grivna, Staff Scientist from ON Semiconductor, details: “Design flexibility gives an option for more Die Per Wafer (DPW) or more active silicon for a given die size. It also allows us to develop adjustable die shape in case of custom applications and custom packaging”.
Compatibility of plasma dicing with standard processing was also mentioned by both partners:  such advantage grants the use of standard dicing frame and tape with comparable die spacing/expansion, yet requires no extra masking layers so costs remain low…

Plasma-Therm’s webcast “Can wafer dicing become a value-add operation?”, is a real opportunity to learn more about plasma dicing process and its added-value. Indeed the semiconductor industry is clearly looking for new technologies to face such challenges and fit with the manufacturing requirements, such as performance, costs … Make sure you understand all challenges and watch the recorded webcast now: Plasma Dicing.
Featured speakers included:
• Pars Mukish, Activity Leader, LED & OLED, Yole Développement
• Thierry Lazerand, Director of Technical Marketing, Plasma-Therm
• Gordon Grivna, Staff Scientist, ON Semiconductor
This webcast was moderated by Jérôme Azemar, Technology & Market Analyst at Yole Développement.

For more information on the webcast, please contact Camille (veyrier@yole.fr).



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