|
|||||||||||||||||
|
|
Home
> ADVANCED PACKAGING
> Himax selects EVG to expand production capacity for wafer ...
> ADVANCED PACKAGING
Mar 28th, 2012
Himax selects EVG to expand production capacity for wafer level optics
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Himax Technologies, Inc., a leading producer of CMOS image sensors, power management devices and semiconductor devices and components used in flat panel displays, has placed a repeat order for an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EVG.
The IQ Aligner will be used by Himax to support the company's capacity increase in the production of wafer-level cameras used in mobile phones, notebook computers and other consumer electronic devices, as well as to support the increasingly stringent manufacturing requirements for wafer-level cameras demanded by Himax's customer base. The IQ Aligner will be shipped and installed at Himax's manufacturing facility in Tainan, Taiwan. Sources :
More ADVANCED PACKAGING news Jun 19th
Jun 12th
Jun 11th
Jun 6th
Jun 5th
|
||||||||||||||||
©2007 Yole Developpement All rights reserved Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr |
|||||||||||||||||