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Apr 8th, 2014
 
How new device technologies will drive power packaging?
 
A power electronics market and technology briefing on power packaging – On Thursday, May 22 from 10:00 AM - Forum Area at PCIM Europe.
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How new device technologies will drive power packaging? A push for improvement and a market evolution market briefing will provide market metrics and forecasted trends for power packaging, and evaluate their impact on the power electronics industry.

Emergence of new wide bandgap (WBG) technologies such as SiC and GaN will definitely reshape part of the established power electronics industry, especially on the high voltage side (respectively high-end solutions up to 900 V for GaN and solutions >1.7kV for SiC). SiC and GaN offer higher frequency switching, higher power density, higher junction T° and higher voltage capabilities. “To now, only a tiny part of the WBG added-value could be captured by using current approaches of packaging solutions. Offers with new enhanced packages strategies can help addressing the demand for improved performance and at midterm, these new power modules could expect targeting a ~$200M market in 2016, even exceeding $1B at longer term (2020+),” explains Jérôme Azémar, Technology & Market Analyst, Yole Développement.

Yole Développement's Power Electronics team will present the findings from its recent power packaging analysis. This will be followed by a presentation of power module main players: APSi3D and Danfoss. Afterwards, all attendees are welcome to participate in a panel discussion, during which we'll compare and contrast different points-of-view and visions. FREE ENTRANCE!

For more information, please contact Camille Veyrier, Media & Communication Coordinator at Yole Développement (veyrier@yole).

 

 
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