webleads-tracker

Home  >  ADVANCED PACKAGING  > Hybrid Memory Cube draft specifications issued by HMC conso...
  >  ADVANCED PACKAGING
Aug 16th, 2012
 
Hybrid Memory Cube draft specifications issued by HMC consortium
 
The Hybrid Memory Cube Consortium released to its members an initial draft of interface specifications for its 3-D DRAM memory stack. The group is now in final review of the specs with plans to release them publicly near the end of the year.
Send to a friend
Hybri Memory Cube
Hybri Memory Cube

The group has so far defined two specifications—an interface protocol and a short-reach physical layer channel. The PHY is optimized for use connecting a memory cube and chips sitting multiple inches of printed circuit board traces away in a networking system.

Full text here.

 

 
More ADVANCED PACKAGING news

Aug 12th
Aug 12th
Aug 11th
Aug 8th
Aug 6th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr