Hynix's VGA ShellUT Type CSP CMOS Image Sensor

Applications for this type of sensors include cell-phone and notebook webcams which are mostly sold onto the chinese market currently. In the future, such type of image sensors are also expected to enter the automotive and medical camera applications.

This new package technology has been implemented  onto current Hynix's NeoPac wafer packaging line which is itself based on OptoPac (KR) packaging IP. This move to Tessera owned packaging technology now enable Hynix to form backside "edge" electrical contacts at the wafer level. The production is said to have already started in Q4-2009.