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Feb 24th, 2012
IBM demonstrate voltage regulator integration on 2.5D silicon interposer platform
The world's first integrated voltage regulators can be located on the bottom of a 3-D chip stack, according researchers at IBM and Columbia University, who recently demonstrated a silicon interposer containing the necessary magnetic inductors at the International Solid State Circuits Conference (ISSCC) in work funded by Semiconductor Research Corp. (SRC) and the U.S. Department of Energy.
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By locating the magnetic inductors on the bottom of a 3-D chip stack, the demonstration showed how a voltage regulator's ordinarily bulky discrete components can be integrated into an otherwise CMOS design flow.  Although the through-silicon-vias (TSVs) and other voltage regulator components were absent, the proof-of-concept demonstration shows how voltage regulators on silicon interposers can be integrated into future 3-D chip stacks.

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