ICAP Ocean Tomo engaged to sell patent portfolio of wafer-level semiconductor packaging owned by Hymite. This IP portfolio include interesting technologies for the wafer level packaging of LED, MEMS, and optical communications component packaging.

ICAP Ocean Tomo, the intellectual property brokerage division of ICAP Plc  (IAP.L), is offering for sale, a patent portfolio relating to  wafer-level semiconductor packaging owned by Hymite A/S. The 77 issued  U.S. and foreign patents and patent applications cover new packaging technologies for Optical Communications components, LED emitters, and semiconductor fabrication.

The assets disclose cost efficient wafer-level semiconductor packaging techniques applicable to high power as well as high frequency applications, including LED, MEMS, and optical communications component packaging. Key technologies of this portfolio include high current carrying through-wafer interconnects (through-silicon via, TSV), thereby enabling wafer-level surface mount (SMT) chip-size packaging (WLP-CSP)  which in turn improves manufacturability (reduces costs), increases performance, enables reduced component size and improves product  scalability. The patents also include a high power/brightness LED packaging solution that offers excellent thermal performance in a highly manufacturable platform, as well as, MEMS packaging technology that features flux-less hermetic sealing on the wafer level with controlled internal package atmosphere. Several of the technologies included in this portfolio have been developed to the production phase and the related know-how is included.

“Through the use of wafer-level packaging, this technology will provide significant cost savings to the manufacturer of semiconductors for high power applications.” said Dean Becker of ICAP Ocean Tomo. “This portfolio should be of interest to any entity operating in the semiconductor field.”

“Hymite is pleased with the general acceptance of its unique technology in the market - major players in high speed communications, high-power LEDs and MEMS have already engaged Hymite on developing unique products,” Christian Tang-Jespersen, Hymite President &CEO, added. “Our unique and innovative wafer-level packaging technology has not only helped to significantly improve performance and cost-effectiveness of  existing products but has also become an enabler for novel next generation capabilities and products. As a result, we, and our customers, are seeing our technology and products as a general market enabler for attractive emerging market segments where high performance, high volume manufacturing capability and rapid scalability are highly valued”.

About ICAP Ocean Tomo LLC
ICAP Ocean Tomo is the intellectual property brokerage division of ICAP.

About ICAP
ICAP is the world’s premier interdealer broker and provider of post trade services. The Group matches buyers and sellers in the wholesale markets in interest rates, credit, commodities, foreign exchange, emerging markets, equities and equity derivatives through voice and electronic networks. ICAP is also the source of global market information and research for professionals in the international
financial markets. ICAP plc was added to the FTSE 100 Index on 30 June 2006.