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Mar 9th, 2011
IMT adds sixth bond option to its arsenal of hermetic wafer level packaging
IMT, a pioneer in the development and implementation of wafer level packaging, introduced its hermetic gold-to-gold (Au-Au) thermo compression bonding today.
In development for nearly a year, this bond is being actively used in production, and it represents one of the lowest cost methods of achieving a hermetic wafer level package (WLP) bond available in the market.
In addition to the Au-Au thermo compression and the other bond technologies supported, IMT’s flagship remains its proprietary low-temperature hermetic eutectic bond. With sealing temperatures below 190oC and support for reflow temperatures of more than 500oC, this bond is ideal for temperature-sensitive sensors or electronics that require a hermetic package. The bond line width is controlled at less than 50 microns maximizing space for application functionality while keeping the package small and product costs lower.
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