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> ADVANCED PACKAGING: 3D IC, WLP & TSV BUSINESS/MARKET
Aug 30th, 2010
IWLPC 2010: The Package for Success!
International Wafer-Level Packaging Conference & Tabletop Exhibition - October 11-14, 2010 - Santa Clara Marriott, Santa Clara, CA
Join the expanded three-track program of the International Wafer-Level Packaging Conference (IWLPC) as it brings together some of the semiconductor industry's most respected international authorities who will address all aspects of wafer-level, 3D IC, and MEMS device packaging in an impressive four-day program.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
The IWLPC kicks off on October 11 & 12 with two days of professional tutorials led by instructors drawn from the pre-eminent authorities in their fields. Each tutorial represents an outstanding opportunity to meet with your peers in a relaxed atmosphere for an intensive course mentored by an expert.
The IWLPC tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.
The IWLPC tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.
Tutorial Topics Include:
- Three Dimensional Assembly, Packaging & Integration
- Advanced Packaging Technologies and Future Interconnection Trends
- Wafer Level Packaging
- 3D Packaging and WLP Evolution and Trends
- Advanced Flip Chip Technology and Processing
- Main Challenges and Key Technologies for 3D Integration
The technical conference and tabletop exhibition will run on October 13 & 14. The IWLPC technical conference includes three tracks of technical presentations covering Wafer Level Packaging; 3‐D (Stacked) Packaging; and MEMS Packaging. Over fifty technical presentations will be given and a CD-Rom Proceedings with the corresponding technical papers will be available for all conference registrants.
The IWLPC Tabletop Exhibition will include over 40 of the industry’s top supplier companies. Registration to attend the exhibition is FREE.
Visit www.iwlpc.com to view all of the event information and for registration.
The IWLPC is sponsored by PacTech USA, Amkor Technology, EV Group, NEXX Systems and Technic and supported by MEPTEC, MEMS Investor Journal, and Micronews.
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Yole Développement: 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr