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Mar 23rd, 2012
 
Imra, Disco collaborate on fiber lasers for semiconductor dicing
 
Femtosecond fiber laser manufacturer Imra America Inc. of Ann Arbor, Mich., a subsidiary of Aisin Seiki Co. Ltd. of Kariya, and Disco Corp. of Tokyo have teamed to develop new lasers and processing systems for laser dicing of semiconductor materials.
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The companies will provide solutions that use the capabilities of femtosecond lasers, which feature minimal thermal effects in materials processing.

Imra America is the exclusive licensee of US Patent No. 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which it licenses to its customers. The company has supplied many femtosecond fiber lasers to semiconductor manufacturing facilities for around-the-clock operation.

Disco manufactures precision cutting, grinding and polishing machines.

 

 
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