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Sep 5th, 2012
 
Industry migration to 3D ICs to take place in 2015-16
 
The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production of 3D ICs was previously estimated to take place in 2014, the sources indicated.
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Leading foundries and backend assembly and test service companies have all devoted much of their R&D efforts to TSV development, and are making progress, the sources said.

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