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Dec 13th, 2013
Invensas and Tezzaron partner to deliver commercial 3D-IC products
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced that it is partnering with Tezzaron Semiconductor Corporation, a pioneer and producer of 3D Integrated Circuit (3D-IC) semiconductor devices, in order to build a wide range of 3D-IC customer products.
"Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking," stated Robert Patti, CTO of Tezzaron. "Invensas' 3D-IC packaging expertise and existing pilot assembly line capability will enable us to ramp our unique products into full production. The Invensas combination of technology development and low volume manufacturing capabilities are unlike anything else available."
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