Invensas Corporation, a subsidiary of Tessera Technologies, Inc., will showcase its latest mobility solution, an ultra-high bandwidth Bond Via Array (BVATM) Package-on-Package (PoP) product, at the upcoming IEEE Electronic Components & Technology Conference (ECTC) in Las Vegas, NV on May 28 - 31, 2013.
The solution was brought to high volume market readiness in collaboration with Kulicke & Soffa Industries, Inc. (K&S), Universal Instruments Corporation, and Celestica Inc.
“The BVA platform provides smartphone and tablet makers with a roadmap to much higher bandwidth and lower power consumption, enabling high definition mobile gaming, multi-channel video, and a host of new data-rich applications on next generation mobile devices,” said Simon McElrea, president of Invensas Corporation. “With greater than 1,000 interconnects, twice that of the current competition, in a tiny 14x14mm package-on-package form factor, BVA is by far the mobile industry's highest bandwidth solution.”
The technology, which relies on conventional manufacturing infrastructure, enables the interconnection of System on Chip (SOC), Central Processing Unit (CPU), and Graphics Processing Unit (GPU) chips with their associated memory chips. It accommodates Double Data Rate 3/4 (DDR3/4 ) DRAM, Low Power Double Data Rate (LPDDR) and “Wide-IO” DRAM, as well as Flash and Multi Chip Package (MCP) memory. 512 bit memory bus width is supported which, at 800MHz operation, delivers an unprecedented 100GB/s bandwidth.
Invensas will display the technology at the 2013 ECTC in the Cosmopolitan Hotel, Las Vegas, NV, on May 28 - 31, 2013. In addition, Invensas will present a white paper “Package-on-Package with Very Fine Pitch Interconnects for High Bandwidth” on Thursday May 30, 2013 at 4:45pm PT.