Home  >  ADVANCED PACKAGING  > Is Wide I/O a game changer?...
May 31st, 2012
Is Wide I/O a game changer?
Here is a great article from www.edn.com by Brian Bailey released on May 29th about Wide IO and 2.5D Interposer technology.
Send to a friend

I was recently writing an article about an emerging technology for silicon die stacking — often referred to as 3D ICs. The promise is that instead of trying to squeeze everything onto a single die, you can use multiple dies. Each die may use a different fabrication technology optimized for that particular type of circuitry, such as memory, logic, analog, sensors etc. The dies are connected using Through Silicon Vias (TSVs), much the same as vias on a printed circuit board (PCB).

Most of the companies using this technology today have not yet combined the functional dies with TSVs. Instead they are using an interposer that acts just like a PCB. It performs the routing between the functional dies, but does not contain active components itself.

Full article here.



Jul 30th
Jul 29th
Jul 23rd
Jul 22nd
Jul 21st
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr