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May 31st, 2012
Is Wide I/O a game changer?
Here is a great article from www.edn.com by Brian Bailey released on May 29th about Wide IO and 2.5D Interposer technology.
I was recently writing an article about an emerging technology for silicon die stacking — often referred to as 3D ICs. The promise is that instead of trying to squeeze everything onto a single die, you can use multiple dies. Each die may use a different fabrication technology optimized for that particular type of circuitry, such as memory, logic, analog, sensors etc. The dies are connected using Through Silicon Vias (TSVs), much the same as vias on a printed circuit board (PCB).
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