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Feb 17th, 2012
KYOCERA America doubles its flip-chip assembly capacity
Kyocera America, Inc. announced that it has doubled its flipchip assembly capacity for microelectronic devices with a new $3.5 million Class 10,000 clean room, offering lead-free processes as one of North America's only Qualified Manufacturer's List (QML)-certified flip-chip assembly providers.
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Ribbon Cutting at KYOCERA America.
Ribbon Cutting at KYOCERA America.

The new clean room offers the latest available technology, including fine-pitch flip-chip, multiple components within one operation, vacuum die-attach and vacuum-assembly sealings for flip-chip and multi-chip module assembly. The expansion also reduces overall cycle times for all levels of manufacturing.

"We can now support customers from prototype to high-volume production right here in San Diego,protecting intellectual property by not sending it offshore,"
said Tim Roth, General Manager of Kyocera's Assembly Technology Division. "Along with higher volume production, Kyocera now offers lead-free flipchip assembly, ahead of federal RoHS regulations which take effect in 2014."

Kyocera provides assembly services for diverse microelectronics markets, including high-speed digital communications, high-reliability applications, high-count I/O devices, high-end servers, multi-core processors and data transport infrastructure. The company recently increased its engineering staff to provide additional customer service, design and development expertise.

The expansion adds to Kyocera's long history and commitment to the microelectronics industry. In 2011, Kyocera marked its 40th anniversary of U.S. microelectronic package manufacturing; it has also offered cost-effective manufacturing at Kyocera Mexicana since 1988; and it has performed assembly services in San Diego since 1991.


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