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Oct 1st, 2012
Karlsruhe Institute of Technology (KIT) develops "photonic wire bond" for optical chip connections
Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" and femtosecond lasers, that achieves data transmission rates of several Tbit/sec.
Developing and integrating high-performance optical emitters and receivers onto semiconductors is already a reality, but it's been harder to figure out how to actually bridge chips optically. "The biggest difficulty consists in aligning the chips precisely such that the waveguides meet," explains Christian Koos, professor at the KIT Institutes of Photonics and Quantum Electronics (IPQ) and of Microstructure Technology (IMT) as well as member of the Center for Functional Nanostructures (CFN).
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