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Sep 3rd, 2013
Leading integrated laser company Nanoplus orders Oxford Instruments systems for laser bar facet coating and compound semiconductor etching
Oxford Instruments Plasma Technology (OIPT), one of the world’s key manufacturers of plasma etch and deposition systems, has just received an order from Nanoplus in Germany for an ion beam deposition and a plasma etch system for use on novel types of semiconductor laser production.
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Nanoplus produces semiconductor lasers over several wavelength ranges (some exclusively) for many different customers with a wide range of applications. The Ionfab300 Plus ion beam deposition is a multi-batch cassette loading tool allowing many devices to be produced for several applications and various customers in one load. The Ionfab300 Plus will be used for laser bar facet coating with anti-reflective and high-reflection multilayers, and the PlasmaPro System100 RIE system will be used for GaAs and InP compound etching.

Dr David Pearson, OIPT’s Senior Ion Beam Technologist, comments, “Our Ionfab optical coating tools are becoming the tools of choice for many types of precision optical coatings worldwide, in particular in laser applications.”

Nanoplus is an internationally leading supplier of single mode DFB lasers for sensing, metrology, spectroscopy and telecom applications. We even have one of our sensors on NASA’s Mars Curiosity Rover.’, commented Prof. Dr. Alfred Forchel, founder of Nanoplus, ‘We chose Oxford Instruments systems for their versatility, superior process capabilities and excellent customer support.”

Frazer Anderson, Business Group Director at Oxford Instruments said, “Our tools offer the ideal platform for production as well as research & development in many new application areas, and Laser Bar facet coating is just one of these.  Our excellent process applications team and global service support ensure that our customers are supported in every respect and can count on their Oxford Instruments systems for maximum uptime and reliability.”

About Oxford Instruments plc
Oxford Instruments designs, supplies and supports high-technology tools and systems with a focus on research and industrial applications. It provides solutions needed to advance fundamental physics research and its transfer into commercial nanotechnology applications. Innovation has been the driving force behind Oxford Instruments' growth and success for over 50 years, and its strategy is to effect the successful commercialisation of these ideas by bringing them to market in a timely and customer-focused fashion.

The first technology business to be spun out from Oxford University over fifty years ago, Oxford Instruments is now a global company with over 1900 staff worldwide and is listed on the FTSE250 index of the London Stock Exchange (OXIG).  Its objective is to be the leading provider of new generation tools and systems for the research and industrial sectors.

This involves the combination of core technologies in areas such as low temperature, high magnetic field and ultra high vacuum environments, Nuclear Magnetic Resonance, X-ray, electron and optical based metrology, and advanced growth, deposition and etching.

Oxford Instruments aims to pursue responsible development and deeper understanding of our world through science and technology. Its products, expertise, and ideas address global issues such as energy, environment, security and health. 

About Oxford Instruments Plasma Technology
Oxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for the etching of nanometre sized features, nanolayer deposition and the controlled growth of nanostructures.

These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition, deep silicon etch and physical vapour deposition. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.


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