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Jun 26th, 2014
 
MEMS wafer inspection system from Sonoscan
 
Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers.
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Based on Sonoscan’s C-SAM technology, the system images and identifies internal gap-type defects down to 5 microns in size. It is especially useful for finding non-bonds, voids and other defects in the seals surrounding the MEMS wafer cavities.

AW322 200 system features include:

  • Two loadports, two stages and multiple transducers, enabling it to image two 8-inch MEMS wafers simultaneously.  Other models in the AW series are available to accommodate wafer sizes from 100-300mm.
  • The SECS/GEM-enabled Robotic Handling Station includes alignment and drying operations.
  • Waterfall technology to minimize water exposure during scanning.
  • Sonoscan’s advanced analysis software for accurate application of the user’s accept/reject criteria.
  • In operation, the Robotic Handling Station counts and unloads wafers from the carriers, aligns wafers for scanning and positions wafers on the stage. The transducers travel over 1 m/s while pulsing ultrasound at frequencies up to 230 MHz and receiving thousands of return echoes per second.  Both the transducers and the 500 MHz bandwidth pulser/receiver were designed and manufactured by Sonoscan.

The key defects imaged in MEMS wafers are non-bonds of the seal to a wafer, voids within the seal material and other gap-type defects that can compromise the hermeticity of the cavity.

After scanning, both the acoustic wafer image and the wafer data can be used for accept/reject determination. Criteria are defined by the user with respect to acceptable defect counts and sizes.


 
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