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Jun 13th, 2013
 
MIDIS™ platform breaks the one-process-per-product MEMS paradigm
 
I-Micronews.com webcast on June 27 at 8.00 AM PDT.
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I-Micronews proudly presents Teledyne DALSA’s webcast, a live event taking place on June 27 at 8:00 AM PDT on I-Micronews.com, in the “Upcoming Webcasts” section or click MIDIS™ . Teledyne DALSA’s webcast will provide attendees with insight into the company’s innovative technology, MIDIS™, and how to develop a standard manufacturing process for motion sensing devices.

Motion sensing devices are one of the MEMS industry’s hottest topics, and one reason is increased combo solution adoption. “Yole Développement expects the market for 6 and 9-axis sensors to grow from $598M in 2013 to $2.34B by 2018”, said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies. With this in mind, successful players should take advantage of a technology optimized for cost and size reduction (i.e. with product platforms, new bonding technologies and less-demanding vacuum requirements) while allowing multi-sensor integration.

Last week, Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, announced the availability of its new MIDIS 200mm MEMS fabrication platform for motion sensing devices. MIDIS™ provides high-volume, low-cost accelerometer and gyroscope manufacture, or the integration of both into an Inertial Measurement Unit (IMU) – thereby addressing the increased demand for inertial sensors in consumer (mobile), automotive and sports/health applications.

During this webcast, attendees will learn about this 200mm MEMS technology’s key features. Teledyne DALSA will detail how MIDIS™ allows accelerometers, gyroscopes and combo-sensors to be integrated in a very compact, hermetic wafer-level package which can be wire bonded or solder bumped. The company will also highlight how a high vacuum can be maintained in the package cavity, allowing resonator Q factors in excess of 20,000 without the need for expensive getters.

The MIDIS™ platform was successfully deployed to alpha customers and is now being released to a wider market.

This live webcast occurs on June 27 at 8.00 AM PDT. To register, please visit the “Upcoming Webcasts” section of the I-Micronews.com website, or click MIDIS™.

Featured speakers include:
• Luc Ouellet, Vice President of Technology Development, Teledyne DALSA Semiconductor
• Laurent Robin, Activity Leader, Inertial MEMS Devices & Technology, Yole Développement
Mike McLaughlin, Business Development at Yole Inc., will moderate

A Q&A session will follow the presentations.

About Teledyne DALSA Semiconductor
Located in Bromont, Quebec, Canada, Teledyne DALSA's award-winning semiconductor wafer foundry has a proud history of innovation in specialties such as MEMS, CCDs and high-voltage CMOS. As a pure-play foundry, our goal as a manufacturing partner is to deliver innovative foundry capabilities to fabless and fab-lite semiconductor companies and help them succeed with their advanced MEMS or IC designs. For more information, please visit www.teledyneDALSA.com/semi.

About Teledyne DALSA, Inc.
Headquartered in Waterloo, Ontario, Canada, Teledyne DALSA, a Teledyne Technologies company, is an international leader in high-performance digital imaging and semiconductors, with approximately 1,000 employees worldwide. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, please visit www.teledyneDALSA.com

About Micronews Media & Yole Développement
Micronews Media has a global subscriber base of key decision makers seeking relevant, timely news and analysis in disruptive wafer-based manufacturing markets. Micronews Media includes the I-Micronews website, Micronews magazine, and five technology magazines: MEMS Trends, 3D Packaging, iLED, Power Dev' and Image Sensor Industry.

Yole Développement employs 50+ analysts who work diligently to uncover the trends and technologies driving product innovation and market opportunities worldwide. In an average year, our analysts conduct 2,500+ interviews; combine this with our comprehensive market reports and analyses and it’s easy to see that we create unique media content not available anywhere else, especially in the traditional media model.

Micronews Media aims to help companies and their leaders understand market-driving technologies. Our informative media assets reach 42,000+ subscribers and visitors, and we offer unmatched visibility across the industries we serve, via options such as annual magazine sponsorships – editorial webcast sponsorships – custom webcasts – one-shot announcements -- and much more.
For more information, please visit www.yole.fr / www.i-micronews.com, or contact Sandrine Leroy, Media & Communication Manager (leroy@yole.fr).

 

 
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