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> Mattson Technology ships Alpine® Etch System to a leading ...
> ADVANCED PACKAGING: 3D IC, WLP & TSV
Jul 13th, 2010
Mattson Technology ships Alpine® Etch System to a leading foundry for advanced packaging applications
Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has shipped the Alpine® etch system to a leading foundry customer in Asia.
The company noted that the system shipped under an evaluation agreement and that it will be used for advanced wafer level packaging applications. The shipment marks the Alpine system's second major placement in the packaging arena, where the cost-of-ownership and ion control provide key differentiation against other etch tools available in the market. Sources :
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