webleads-tracker

Home  >  ADVANCED PACKAGING  > MiNaPAD 2012 - Conference technical program available...
  >  ADVANCED PACKAGING
Mar 30th, 2012
 
MiNaPAD 2012 - Conference technical program available
 
The second edition of the Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD) will be held on April 24-26, 2012 at the Minatec campus in Grenoble, France.
Send to a friend

MiNaPAD gathered 200 international participants. The exhibition hall was fully booked with 30 booths and the 35 technical presentations were unanimously hailed as "world standard quality". We therefore decided to host a second edition and we are proud to invite you to participate actively to MiNaPAD 2012.

The  event will begin on April 24 in the morning with four tutorials, followed in the afternoon by a workshop Beyond 300mm sponsored by SEMI and hosted by IMAPS.  On April 25-26, the MiNaPAD conference and exhibition will feature three keynote speeches, 36 papers in two parallel sessions, a poster session and 28 exhibitors.  

Access the program here.

For further information on the tutorial and conference agenda and registration information, please refer to the website http://france.imapseurope.org (Click on the tab Prochainement/Next). Or contact Florence VIRETON at +33(0) 1 39 67 17 73 or by e-mail: imaps.france@imapsfrance.org.

Further information for the SEMI event  Beyond 300mm may be found at the website www.semi.org/beyond300mm.

 


 
More ADVANCED PACKAGING news

Apr 17th
Apr 17th
Apr 9th
Apr 9th
Apr 9th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr