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Mar 19th, 2014
Micron to release more commodity DRAM packaging orders to Taiwan backend service suppliers
Micron Technology reportedly plans to release more backend packaging orders for its commodity DRAM chips to Taiwan-based IC testing and packaging companies starting the first half of the second quarter of 2014, according to industry sources.
Micron is currently rolling out standard DRAM chips from its plant in Malaysia but plans to switch the plant's production from DRAM chips to NAND flash products, and therefore it needs to outsource packaging capacity to Taiwan, the sources noted.
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