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Mar 12th, 2013
Micronit MEMS to showcase through glass metallized via technology at SSI
Micronit MEMS will present its capabilities in MEMS packaging on 13 and 14 March at the Smart Systems Integration 2013.
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Micronit will show its latest results and capabilities on its patented Through Glass Metallized Via Technology. Micronit MEMS offers a variety of micromachining processes for glass or silicon wafers. Micronit offers product development and foundry services for MEMS packaging, with specialisation in structured glass wafers.
Micronit MEMS provides foundry services on 100, 150 and 200 mm wafers, with proven capabilities in:

  • Through glass metallized vias
  • Room temperature bonding
  • Structured glass substrates
  • Glass and silicon machining
  • Cavities and vias

Micronit has over a decade of experience in micromachining glass substrates and a broad portfolio of capabilities in both Microfluidics and MEMS-applications. “The dedicated MEMS activity is a result of growing demands from our customers for processing substrates for MEMS applications.  Our own cleanroom facilities and our experienced R&D and Sales teams ensure we provide a complete service. The addition of through glass metal via technology and low temperature hermetic bonding completes our capability portfolio for MEMS packaging. We can now be a partner in every stage of MEMS product development from idea to full scale manufacturing”, explains Ronny van ‘t Oever, Managing Director and co-founder of Micronit.
Target markets for Micronit MEMS are (amongst others): LED applications, photovoltaics, static and active displays, fuel cells and sensors in general. In all of these application areas combinations of glass with other materials such as silicon are already widely used. 
The Micronit manufacturing line is capable of processing tens of thousands of wafers per year in various substrate sizes (100mm to 200mm). Micronit is ISO 9001 certified. 

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