Home  >  ADVANCED PACKAGING  > Microsoft to join 3D TSV DRAM Consortium...
May 9th, 2012
Microsoft to join 3D TSV DRAM Consortium
The Hybrid Memory Cube Consortium (HMCC) — the 3D DRAM effort led by Micron Technology Inc. and Samsung Electronics Co. Ltd. — said that software giant Microsoft Corp. has joined the group.
Send to a friend

Last October, memory rivals Samsung and Micron announced the creation of a consortium to develop an open interface specification for a 3D memory technology called the Hybrid Memory Cube (HMC). The HMCC is developing 3D DRAM devices based on through-silicon-via (TSV) technology.

Full text here.



Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr