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May 9th, 2012
Microsoft to join 3D TSV DRAM Consortium
The Hybrid Memory Cube Consortium (HMCC) — the 3D DRAM effort led by Micron Technology Inc. and Samsung Electronics Co. Ltd. — said that software giant Microsoft Corp. has joined the group.
Last October, memory rivals Samsung and Micron announced the creation of a consortium to develop an open interface specification for a 3D memory technology called the Hybrid Memory Cube (HMC). The HMCC is developing 3D DRAM devices based on through-silicon-via (TSV) technology.
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