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Aug 6th, 2014
 
NCAP and Yole symposium: the final agenda includes key players!
 
NCAP and Yole announce the Advanced Packaging & Integration Technology Symposium and the final agenda.
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Yole Développement (Yole) and National Center for Advanced Packaging (NCAP China) collaborate to develop a powerful program and attract the leaders of the advanced packaging industry. Both partners, strongly involved in this area, propose a dedicated event, Advanced Packaging & Integration Technology Symposium, focused on:
• 3D integration technologies and market trends
• Interposers activities, technology roadmaps and key players
• MEMS packaging
• Manufacturing readiness

This symposium is the first packaging event organized by Yole in China. Due to the market expansion in this area, the market research, technology and strategy consulting company would like to confirm its business positioning and offer to its network a wonderful opportunity to exchange and learn more about the advanced packaging industry evolution and the latest technology trends. This event will take place on August 28, in Wuxi, China. Save the date and register now.

Yole & NCAP’s symposium presents three sessions (Final program):
• Interposer & 3D integration technologies
• Sensors & MEMS packages
• Manufacturing challenges

In the past couple of years, we have seen a high interest in embedded technologies, either as a fan-out wafer level packaging or embedded dies and systems in laminate substrates”, says Jérôme Azemar, Technology & Market Analyst, Advanced Packaging.
Are these platforms able to meet the industry requirements, especially when it comes to mobile applications? “During the symposium, we’ll look at the various embedding technologies and activities happening in the industry, the industry players currently active as well as the infrastructure required for further high-volume manufacturing adoption”, he adds. Yole Développement is glad to have the opportunity to present its recent findings from surveying the industry as a preview of its new 2014 Fan-Out and Embedded Die Report.

Moreover, Yole, throughout the symposium, will detail the technology and market trends, highlight technology roadmaps and present the latest market forecasts from its 2014 reports
Since product announcements using 3D IC technology have finally been made for high-end applications, and engineering samples already started to be shipped, there is no doubt anymore that 3DIC will be adopted for this segment”, says Rozalia Beica, CTO of Yole. “The question remaining is when will the consumer market, where the cost is so critical, will follow TSV adoption?...”she adds.

The symposium will provide a great opportunity for networking with leading packaging organizations from China and around the world, for debating current and future trends of the packaging innovations, manufacturability and collaboration activities across this very dynamic and exciting segment of the industry.  The symposium will end with a panel discussion dedicated to advancements in packaging technologies where various organizations across the supply chain will participate. The panel will be moderated by Rozalia Beica (Yole).

NCAP and Yole are extremely enthusiastic about this symposium and welcome all the organizations participating in this event: ASE, BroadPak, Dow Chemical, EPWorks, Huatian Technology, Nantong Fujitsu, QST Corporation, Rudolph, Sinochip, SMIC, SPIL and SUSS Microtec… To discover the agenda, please click here.

For more information about the agenda and registration, please contact Camille (veyrier@yole.fr), Communication Coordinator, Advanced Packaging at Yole Développement.

About NCAP – www.ncap-cn.com
The National Center for Advanced Packaging Co., Ltd. (NCAP China) is a joint venture established by nine investors, including the leaders of the IC packaging and testing industry in China (Jiangsu Changjiang Electronics Technology, Nantong Fujitsu Microelectronics, Huatian Technology, Shennan Circuit Company, China Wafer Level CSP, AKM Electronic Technology (Suzhou), Jiangsu CAS Internet-of-things Technology Venture Capital, and Shenzhen Fastprint Circuit Tech, and the Institute of Microelectronics of Chinese Academy of Sciences.
NCAP’s goal is to establish a world class R&D center for advanced packaging and system integration, play a leading role in the development and commercialization of advanced technologies for microelectronics packaging and system integration, and promote and sustain the technological and commercial advancement of the microelectronics industry in China.
As a national center for advanced packaging, testing and system integration, NCAP, in collaboration with system OEM’s and supply chain partners, aggressively pursues research and development in order to offer total solutions for the IC industry. NCAP’s current research directions include: 2.5D/3D technology (including TSV), high density wafer level packaging, SiP product development capabilities, and certain advanced materials and equipment technologies for microelectronics packaging.
The NCAP R&D platform includes 3200㎡ cleanroom, equipped with facilities, for 300mm wafer size, for 2.5D/3D IC backend processes, and packaging assembly, testing and reliability, as well as design and simulation capabilities.

About Yole Développement – www.yole.fr
Founded in 1998, Yole Développement has grown to become a group of companies providing marketing, technology and strategy consulting, media in addition to corporate finance services. With a strong focus on emerging applications using silicon and/or micro manufacturing, Yole Développement group has expanded to include more than 50 collaborators worldwide covering MEMS, Compound Semiconductors, LED, Image Sensors, Optoelectronics, Microfluidics & Medical, Photovoltaics, Advanced Packaging, Manufacturing, Nanomaterials and Power Electronics.
The group supports industrial companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
CONTACTS
For more information about:
• Consulting Services: Jean-Christophe Eloy (eloy@yole.fr)
• Financial Services: Géraldine Andrieux-Gustin (Andrieux@yole.fr)
• Reports business: David Jourdan (jourdan@yole.fr)
• Corporate Communication: Sandrine Leroy (leroy@yole.fr)

 

 
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