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Home  >  ADVANCED PACKAGING  > Novati technologies licenses Ziptronix’s direct oxide ...
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Jan 16th, 2013
 
Novati technologies licenses Ziptronix’s direct oxide bonding and direct bond interconnect technologies for 3DIC applications
 
Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®.
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We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI image sensors and a developing host of other applications,” said Dan Donabedian, CEO of Ziptronix. “With our DBI, which contains interconnect at the bond interface, Novati can now provide technologically advanced services in many different markets at a lower cost and better performance compared to competing technologies also attempting 3D integration."

"Adding Ziptronix 3D process technologies to Novati's existing wafer fabrication and testing facilities enables Novati to become the first open-platform, full-line foundry in the world offering 3D stacking services and test to all its customers," said Dave Anderson, CEO of Novati Technologies. "We believe 3D is the new cutting edge of product development and we intend to continue our heritage as a contract R&D and lab-to-fab production facility enabling customers to cost-effectively prototype and test both 2.5D interposer and 3D designs with true, 3D integration and TSV interconnect."


 
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