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Jan 16th, 2013
Novati technologies licenses Ziptronix’s direct oxide bonding and direct bond interconnect technologies for 3DIC applications
Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®.
“We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI image sensors and a developing host of other applications,” said Dan Donabedian, CEO of Ziptronix. “With our DBI, which contains interconnect at the bond interface, Novati can now provide technologically advanced services in many different markets at a lower cost and better performance compared to competing technologies also attempting 3D integration."
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