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Dec 7th, 2012
Odis produces laser for chip-to-chip interconnects
A new integrated laser device that serves as the basis for chip-to-chip interconnection could surpass the capabilities of CMOS technology, according to Odis Inc., a US affiliate of OPEL Technologies Inc.
The vertical cavity laser (VCL) by Odis fuses optical and electronic devices on a single chip. The new device, which helped the company to achieve a milestone in its planar optoelectronic technology (POET), offers the semiconductor industry the ability to push Moore’s Law to the next level by overcoming current silicon-based bottlenecks. It also has the potential to change the roadmap for smartphone, tablet and wearable computer applications. Sources :
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