Powertech Technology (PTI) has managed to increase the ratio of logic IC backend service business to more than 20% of its total sales recently, and expects its 3D IC technology to start generating income in 2014.
PTI's recent acquisition of a controlling stake in logic IC packaging firm Greatek Electronics has allowed PTI to accelerate the adjustment of its product mix. PTI used to have more than 70% of revenues come from its DRAM packaging and testing service business, but the ratio has been reduced to about 50%, according to company data.
In the first quarter of 2012, sales of DRAM backend services accounted for 51% of PTI's overall revenues followed by the NAND flash segment with 26%. Logic IC products made up the remainder.
In the second quarter, when PTI entered the board of directors at Greatek, sales of logic IC packaging and testing climbed to account for 23% of PTI's overall revenues while the sales ratios for the DRAM and NAND flash segments slipped to 51% and 26%, respectively.
The sales ratio for DRAM packaging and testing is set to dip further to 40% in the third quarter, PTI indicated. The firm added that its investment in the business segment will remain focused on mobile DRAM and server-use memory products.
PTI also revealed that part of its production lines for DRAM memory will be modified into new lines for NAND flash packaging and testing. PTI added it will focus on facilities for its high-end packaging technologies and testing tools for SSD-use NAND flash memory.
In addition, PTI noted that the company is making progress in the development of 3D IC packaging and other advanced technologies including package-on-package (PoP) and high-end SSD-use NAND flash memory. Samples of PTI's 3D through-silicon-via (TSV) packages have been delivered to customers for verification, said the company, adding that its 3D IC packaging services are expected to generate revenues starting the first half of 2014.