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May 30th, 2012
Advanced Packaging drives metrology capability on inspection systems
Advanced packaging is also driving smaller geometries. It is all relative of course. Not long ago, the norm for bump heights was approximately 100µm.
Cu Pillar heights of 20µm and heading smaller are not uncommon. While there was interest in knowing the height from the top of the polyimide layer to the bump top, most customers settled for the height from wafer surface to the top of bump, since the polyimide layer was a small percentage. With bump heights shrinking dramatically and under-fill still a consideration, geometries of bump top and polyimide surface become important.
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