Home  >  ADVANCED PACKAGING  > Advanced Packaging drives metrology capability on inspection...
May 30th, 2012
Advanced Packaging drives metrology capability on inspection systems
Advanced packaging is also driving smaller geometries. It is all relative of course. Not long ago, the norm for bump heights was approximately 100µm.
Send to a friend

Cu Pillar heights of 20µm and heading smaller are not uncommon. While there was interest in knowing the height from the top of the polyimide layer to the bump top, most customers settled for the height from wafer surface to the top of bump, since the polyimide layer was a small percentage. With bump heights shrinking dramatically and under-fill still a consideration, geometries of bump top and polyimide surface become important.

Full text here.


Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr