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Mar 27th, 2012
Packaging solutions for the new technologies - SEMICON Europa Advanced Packaging Conference Call for papers
On 09-10 October 2012 in Dresden, Germany.
Semiconductor Equipment and Materials International (SEMI) invites Advanced Packaging professionals to submit abstracts for the conference, which will be held in conjunction with SEMICON Europa 09-11 October 2012 in Dresden, Germany. The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems. Presentations on original, non-commercial works describing recent developments are welcomed.
Keynote papers to be based upon:
Papers should cover emerging aspects in:
Application Driven Packaging (Automotive, Power Electronics, Information
Equipment and Materials for:
Evaluation and Processes for:
Instructions to submit an abstract – Submit the following information in an email:
Please submit ALL the above information in one e-mail by 30 April 2012 to firstname.lastname@example.org
Evaluation criteria include significance, usefulness for the manufacturing world and clarity and accuracy as a paper. Abstracts will be peer-reviewed and selected relative to the points above. We encourage application related presentations, i.e. on joint projects between users and suppliers. Papers are to be non-commercial and focus on the technical/economical merits of a process rather than the individual company’s product benefits.
Selected presenters will be notified by 1 June 2012.
For information on SEMICON Europa 2012, please visit www.semi.org/semiconeuropa or contact Carlos Lee, Tel. +32 2 6095334
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