Semiconductor Equipment and Materials International (SEMI) invites Advanced Packaging professionals to submit abstracts for the conference, which will be held in conjunction with SEMICON Europa 09-11 October 2012 in Dresden, Germany. The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems. Presentations on original, non-commercial works describing recent developments are welcomed.

Keynote papers to be based upon:
· Advanced Packaging Technologies
· System Integration Technologies
· Packaging Equipment and Materials
· Europe’s Contribution to the Global Packaging World

Papers should cover emerging aspects in:

Application Driven Packaging (Automotive, Power Electronics, Information
Communication Technologies, Consumers, Live Science/Medical etc) for:
· Microsystems
· Passive devices
· Photovoltaics
· High-Brightness LED
· Fiber Optics
· High-Power Hybrid Modules
· Wireless and RF
· Lab on Chip / Biochips

Equipment and Materials for:
· System in Package (SIP) / 3D-Packaging
· Wafer Level Packaging (WLP) / fan-in and fan-out Packaging
· Through Silicon Vias (TSV)
· Package on Silicon
· System on Chip (SoC)
· Embedded Devices
· Interconnection
· Substrates and Finishes
· Flexible Packages

Evaluation and Processes for:
· Quality and Reliability
· Metrology
· System Testing
· Failure Analysis
· Quality Assurance

Instructions to submit an abstract – Submit the following information in an email:
· Specify which topic your presentation addresses
· Presentation title
· Abstract of 200-400 words (descriptive paragraph identifying issue addressed and solution)
· Short biography of the author(s)
· Main author contact details (Job title, company, address, telephone/e-mail)
· Contact person details i.e. Personal Assistant (Job title, company, address, telephone/e-mail)
· Indicate in subject box of e-mail: SEMICON Advanced Packaging Conference Call for papers

Please submit ALL the above information in one e-mail by 30 April 2012 to europrograms@semi.org
Your presentation may not be included in the review process unless the information is complete.

Evaluation criteria include significance, usefulness for the manufacturing world and clarity and accuracy as a paper. Abstracts will be peer-reviewed and selected relative to the points above. We encourage application related presentations, i.e. on joint projects between users and suppliers. Papers are to be non-commercial and focus on the technical/economical merits of a process rather than the individual company’s product benefits.

Selected presenters will be notified by 1 June 2012.
SEMI Advanced Packaging Conference Committee: Andy Longford, PandA Europe (chairman); Jens Mueller, TU Ilmenau; Andreas Fischer, Bosch; Eric Beyne, IMEC; Klaus Pressel, Infineon; Rolf Aschenbrenner, Fraunhofer IZM; Thomas Oppert, PAC TECH; Steffen Kroehnert, NANIUM; Eef Bagerman, NXP; Albert Koller, Oerlikon; Graham Jones, Henkel; Michel Garnier, STMicroelectronics; Klaus
Schrimper, Hesse-Knipps.

For information on SEMICON Europa 2012, please visit www.semi.org/semiconeuropa or contact Carlos Lee, Tel. +32 2 6095334